3-6” Raw Silicon Wafer
We have advanced silicon chip兵光 processing and quality testing equ腦如ipment and processes such as multi-南業wire cutting machines, double-sided得是 grinding machines, Silicon ch個黑ip chamfering machines, fu書算lly automatic ultrasonic cl體理eaning machines and non-contact sili為著con chip automatic sorting machine站子s. According to the 可家requirements of the I東頻SO 9001:2015 quality 子書management system an視女d the ISO 140001:2015 environmental 熱東management system, we will冷商 strictly adhere to the produc南東t quality clearance and provide semico不頻nductor chip manufacturers with high-qu月師ality single-crystal silic見畫on wafers of various specification照人s.
|
Specifications |
ResistivityΩ·CM |
Thicknessμm |
Crystal Orientation |
Lifeμs |
External Diametermm |
Dopant |
Form |
Radial uniformitty of resistivity |
|||
|
Polishing rod |
Positioning stick |
Chamfering |
Flattingiece |
||||||||
|
3” |
0.001-55 |
200-350 |
<111> |
＞100 |
76.2±0.3 |
Phosphorus/Boron |
√ |
√ |
√ |
√ |
≤20% |
|
4” |
0.001-55 |
200-350 |
<111> 去家 |
＞100 |
101.6±0.3 |
Phosphorus/Boron 老制 |
√ |
√ |
√ |
√ |
≤20% |
|
5” |
0.001-55 |
200-350 |
<111> 紙多 |
＞100 |
125±0.3 |
Phosphorus/Boron 下麗 |
√ |
√ |
√ |
√ |
≤20% |
